In high-temperature metal joining processes (welding, brazing and soldering), the primary purpose of flux is to prevent oxidation of the base and filler materials. Tin-lead solder, for example, attaches very well to copper, but poorly to copper oxides (which form quickly at soldering temperatures). Flux is nearly inert at room temperature, yet becomes strongly reductive when heated. This helps remove oxidation from the metals to be joined, and inhibits oxidation of the base and filler materials. Secondarily, flux acts as a wetting agent in the soldering process, reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined.